●strong heat resistance at continuous temperature of 500℃ to 800℃
●high dielectric strength
●good stampable performance
●excellent mechanical strength
●environmental protection and nontoxic
●UL-94V-O certified
Application
These silicone-bonded rigid mica plates are designed for thermal and electrical insulation for various heating elements, household appliances, and other electrical components. They are offered in five different types to meet the individual requirements of users, providing outstanding electrical insulation at high temperature.
◇PB5662-1: A special low smoke and blister-free grade. It fully resists the extreme high temperature cycles typically encountered for example, in food grade toasters, micro-wave oven
◇PB5662-2: Standard grade for all heating elements of hair dryers, irons, heating oven, band heaters, nozzle heaters, etc.
◇PB5662-G, A higher density grade with smoother surfaces by steel pressing.. Most suitable for punching highly detailed pieces or when imprinting is required.
◇PJ5662-G: A special low smoke and blister-free grade. Softer and more heat resistant. For extreme high temperature application.
Availability
Sheet of 1000 X 600mm,1000 X 1200mm, 1000 X 2400mm.
Thickness 0.1-1.95mm.
Various strips and punched parts according to customers’ drawings and requirements.
Punchability
PB/J56 Series of rigid heater plates can be easily punched. Tools for punching difficult parts, however, should be provided with spring loaded hold-down plates.
|
Item |
PB5662-1 |
PB5662-2 |
PB5662-G |
PJ5662-G |
Test Standard |
|
Muscovite |
Muscovite |
Muscovite |
Phlogopite |
|
Mica Content* % |
≥92 |
≥90 |
≥90 |
≥90 |
IEC 371-2 |
|
Bond Content % |
≤8 |
≤10 |
≤10 |
≤10 |
IEC 371-2 |
|
Density* g/cm3 |
1.7-2.15 |
1.7-2.15 |
1.7-2.2 |
1.7-2.2 |
IEC 371-2 |
|
Fire Resistance |
Continuous |
500℃ |
600℃ |
500℃ |
700℃ |
QB/08* |
|
Intermittent |
700℃ |
800℃ |
700℃ |
900℃ |
QB/08* |
|
Flexural Strength N/mm2 |
>160 |
>180 |
>180 |
>180 |
ISO178 |
|
Dielectric Strength KV/mm |
>20 |
>20 |
>20 |
>20 |
IEC243 |
|
Insulation Resistance(Ωx cm) |
23℃ |
>1017 |
>1017 |
>1017 |
>1017 |
IEC93 |
|
550℃ |
>1012 |
>1012 |
>1012 |
>1012 |
IEC93 |
|
Water Absorption (%) |
<0.2 |
<0.2 |
<0.2 |
<0.2 |
ISO62 |
|
Thermal Expansion (10-6/K) |
Perpendicularto layer |
100 |
100 |
N/M |
N/M |
QB/08* |
|
Parallel to layer |
10 |
10 |
N/M |
N/M |
QB/08* |
|
Heat Loss at Heating (%) |
500℃ |
<1 |
<1 |
<1 |
<1 |
IEC371-2 |
|
700℃ |
N/M |
N/M |
N/M |
<2 |
IEC371-2 |
|
* The content of mica and bond in 0.15-0.4mm thick mica plate is 92.5% and 7.5%, the one in 0.5-1.0mm thick is 92% and 8% ; the one in 1.1-1.95 mm thick is 91% and 9% . * The density of 0.2 mm below is 1.8 g/cm3 ; The density of 0.2-0.5mm thick mica plate is 2.0 g/cm3 ;The density of 0.6-1.95mm thick mica plate is 2.15 g/cm3; * QB/08: Enterprise standard of Pamica |
|
Note: These technical data are average results of laboratory tests conducted under standard procedures and are subject to variations, and do not constitute a warranty or representation for which we assure legal responsibility. |